发明名称 CONTACT MEMBER, CONTACT, AND ELECTRIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a contact member enabling highly reliable solder joint by suppressing generation of cracks and peeling, and a contact and an electric apparatus using it. SOLUTION: This contact member is equipped with a substrate 20 formed of a copper based alloy while having spring elasticity, and a metallic film 21 containing Co and/or Ni and comprising Sn or a Sn based alloy containing no Pb, to enable highly reliable solder joint. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006185634(A) 申请公布日期 2006.07.13
申请号 JP20040374982 申请日期 2004.12.24
申请人 TOSHIBA CORP 发明人 KURI YUUJI;TAN TORONRON;TANAKA AKIRA
分类号 H01H1/26;C22C13/00;H01H50/56;H01R13/03 主分类号 H01H1/26
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