| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser element capable of miniaturizing it while improving its heat radiating quality, and to provide an optical disk system using the laser element. SOLUTION: In the semiconductor laser element, an LD chip 1 is mounted via a sub-mount member 2 on the side surface of a heat radiating block 3, and the heat radiating block 3 is mounted on a stem 4. Also, a metal cap 7 is welded to the upper principal surface of the stem 4. Further, the other side surfaces of the heat radiating block 3 are contacted directly with the metal cap 7. Moreover, a transparent window glass 5 is bonded by a sealing glass 6 fixedly to the metal cap 7. Furthermore, a laser beam 8 emitted from the LD chip 1 is so transmitted through the window glass 5 as to be emitted to the external. COPYRIGHT: (C)2006,JPO&NCIPI
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