Surface mounted semiconductor component with plastics housing and solder balls as outer contacts, as used for ball grid array (BGA) and large ball grid array (LBGA)

摘要

Surface mounted semiconductor components (1) comprises plastics housing (2) and solder balls (3) as outer contacts (4) on its underside (5), which contains layer (6) of soft solder (7) in edge region (8) of semiconductor component underside.Preferably, soft solder layer is mounting spacer of solder balls of component during its fitting on circuit board. Typically, soft solder layer is shaped like through ring (9) surrounding solder balls. Independent claims are included for circuit board and manufacturing method of surface mounted semiconductor component.