ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS FOR FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS
摘要
A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
申请公布号
WO2011019692(A3)
申请公布日期
2011.05.12
申请号
WO2010US44976
申请日期
2010.08.10
申请人
KULICKE AND SOFFA INDUSTRIES, INC.;DEANGELIS, DOMINICK, A.;SCHULZE, GARY, W.