发明名称 |
Verfahren und Vorrichtung für ein Paket mit zwei Substraten |
摘要 |
A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate. |
申请公布号 |
DE112004001678(T5) |
申请公布日期 |
2006.07.13 |
申请号 |
DE20041101678 |
申请日期 |
2004.09.29 |
申请人 |
INTEL CORPORATION, SANTA CLARA |
发明人 |
RUMER, CHRISTOPHER;SINGH, KULJEET |
分类号 |
H01L23/055;H01L21/58;H01L21/768;H01L23/48;H01L23/498;H01L23/50 |
主分类号 |
H01L23/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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