Cooling device for e.g. optoelectronic semiconductor chip, has two structured layers each with groove, where grooves are placed over one another to form outlet duct, and cooling device is integrated in housing of component to be cooled

摘要

The device has two structured layers (2, 2`) each with an integrated groove. The two grooves with their open side are placed over one another to form an outlet duct. A heat dissipation device (4) is provided in the duct and includes a heat transportation medium e.g. water, ethanol, tri ethylene glycol. The cooling device is integrated in a housing of a component to be cooled and is connected with the component via a heat pipe.