| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of improving reliability wherein, even when an insulation board material and a conductor pattern are expanded/shrinked due to heat and the expansion/shrinkage results in land exfoliation, this does not lead to breakage of the conductor pattern, and to provide an electronic apparatus. <P>SOLUTION: Through-holes 30 and via-holes 31 are formed to a multilayer printed circuit board 21 (four layers) onto which insertion type electronic components 3 are mounted. A conductor 33 forming the inner wall of each through-hole 30 electrically connects lands 23A of a board front side to lands 26A of a board rear side. Similarly, a conductor 34 forming the inner wall of each via-hole 31 also electrically connects lands 23B of the board front side to lands 26B of the board rear side. Further, an inner layer pattern 25B electrically connects the through-holes 30 and the via-holes 31. Electrodes 4 of each electronic component 3 are inserted to the through-holes 30 and electrically connected to the conductor 33 by unleaded solder 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
