An LED package comprises: a package body having therein a LED receiving part including a reflecting surface; an LED mounted within the LED receiving part; a lead mounted within the package body such that first and second ends of the lead are exposed to the outside of the package body. The lead includes first and second conductive parts which are electrically connected to the LED and a non-conductive part which insulates the first and second conductive parts from each other.
申请公布号
KR100601891(B1)
申请公布日期
2006.07.10
申请号
KR20050071366
申请日期
2005.08.04
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
SHIN, SU HO;SHIN, KYU HO;MOON, CHANG YOUL;CHOI, JIN SEUNG;KWEON, SOON CHEOL