| 发明名称 |
FBGA AND COB PACKAGE STRUCTURE FOR IMAGE SENSOR |
| 摘要 |
A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination. |
| 申请公布号 |
KR20060080521(A) |
申请公布日期 |
2006.07.10 |
| 申请号 |
KR20050031897 |
申请日期 |
2005.04.18 |
| 申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY, INC. |
发明人 |
YANG WEN KUN;YANG CHIN CHEN;SUN WEN BIN;CHANG JUI HSIEN;YU CHUN HUI;YUAN HIS YING |
| 分类号 |
H01L27/14 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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