| 摘要 |
A method of forming an isolated line on a wafer is disclosed. The disclosed method comprises preparing a first mask comprising an isolated line pattern and dummy patterns, the dummy patterns being positioned on either side of the isolated line pattern; forming an isolated line pattern and dummy patterns on a wafer by performing a first exposure process using the first mask; preparing a second mask comprising a second pattern, the second pattern being positioned so as to completely cover the isolated line pattern on the wafer; and removing the dummy patterns on the wafer by performing a second exposure process using the second mask. |
