| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a ceramic thick film element arrays (for example, a ceramic piezo-electric element array by PZT etc.) with micro size, high-precision definition, and high aspect ratios etc., in which requirements about cost, efficiency etc. are satisfied. <P>SOLUTION: A ceramic material such as a piezo-electric material is deposited into a mold arranged on a temporary substrate (104), and the mold is removed to obtain a formed element such as the piezo-electric material comprising the ceramic material (106). The element is sintered (108) and bonded to a target substrate (112), and the temporary substrate is removed (114). Further, electrodes may also be optionally deposited on the element (110, 116). For example, the mold is formed with a photoresist material such as SU-8 and others (102). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
