Extreme ultraviolet mirror arrangement used in the semiconductor industry comprises a mirror substrate supporting dielectric layers and an electrically insulating heat transfer layer and a substrate support

摘要

Extreme ultraviolet mirror arrangement (1) comprises a mirror substrate (11) supporting a number of dielectric layers on a first substrate surface to reflect extreme ultraviolet radiation and supporting an electrically insulating heat transfer layer on a second substrate surface and a substrate support (14) which is joined to the heat transfer material by an adhesive layer (13). An independent claim is also included for a method for reflecting extreme ultraviolet radiation using the above mirror arrangement. Preferred Features: The adhesive layer comprises a solder (46) having a melting temperature of less than 100[deg] C, especially less than 80[deg] C. The adhesive layer comprises a layer of adhesive based on plastic.