| 摘要 |
The invention provides a flexible substrate for package of a semiconductor die. The flexible substrate includes a flexible insulating film, a plurality of first leads substantially formed on the flexible insulating film, and at least one loop-shaped second lead substantially formed on the flexible insulating film. The at least one second lead is partially disposed at a corner of a device hole of the flexible film, and is designed as being capable of preventing from fracture induced during the package of the semiconductor die. Preferably, the portion of each of the at least one second lead, to be overlapped over the semiconductor die, exhibits an L-shape, a U-shape or a Y-shape.
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