| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating substrate which is cheap by lessening a manday and is excellent in a heat dissipation nature and an insulation performance, and to provide a semiconductor device using such an insulating substrate. <P>SOLUTION: An insulating substrate 1 comprises a metal base 2 used as a base substrate, an insulating layer 3 which is an ordinary temperature shock solidification film formed on this metal base 2 by an aerosol deposition method, and a circuit pattern portion 4 which is a sprayed coating formed on this insulating layer 3 by a cold spray method. Moreover, the semiconductor device loads this insulating substrate 1 and raises a heat dissipation characteristic. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
