| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball supplying method and a ball supplying apparatus for supplying balls to form solder bumps on semi-conductor wafers and electronic circuit substrates, and further to provide a ball arranging apparatus using them. SOLUTION: In the ball supplying method, the balls are measured and discharged from the ball supplying apparatus by turning the ball supplying apparatus by 180°, and then by returning it to the original state through turning it in the opposite direction. The ball supplying apparatus is composed of a ball storing section, a ball measuring section, and a motor for turning the ball storing section and the ball measuring section. The ball measuring section is composed of a ball measuring cavity, a ball separating and storing cavity, and an exit. The ball storing section is communicated with the exit via a hollow pipe. COPYRIGHT: (C)2006,JPO&NCIPI |
