Sensor has sensor chip with cap arranged as flip chip arrangement and electrical contacting of sensor chip is made by contact element which is arranged between substrate and carrier in area of electrical contacts and conductive strips

摘要

The sensor has a chip cap (8) arranged over thermopile structure (2) and sensor chip (1) with cap is arranged as flip chip arrangement on the carrier (12). The electrical contacting of the sensor chip is made by contact element (15), which is arranged between the substrate (6) and the carrier in the area of electrical contacts (7) and conductive strips (14). Independent claims are also included for the following: (A) Method for assembly of sensor chip on a carrier; and (B) Use of sensor.