| 摘要 |
A device for measuring one or more different properties of soil or a soil-related substance is provided. The device includes a probe that is inserted into the soil or soil-related substance. The probe includes a tip. The tip is electrically insulative and defines apertures. Electrodes are fitted into the apertures. The tip and electrodes are machined together to have a desired shape that is suitable for insertion into a sample. A printed circuit board ("PCB") is located inside the probe. The electrodes are soldered directly to the PCB in one embodiment. A temperature sensing element is also located in the tip, near the electrodes, and is connected electrically to the PCB.
|
