| 摘要 |
An apparatus and method for inspecting metal residue is disclosed, in which the metal residue and its residual thickness are effectively inspected after a chemical mechanical polishing (CMP) process. The apparatus for inspecting metal residues includes a light emitter emitting light having a certain wavelength to a surface of a semiconductor substrate, a light detector receiving light reflected from the surface, and an output device configured to produce a signal corresponding to one or more wavelengths of said reflected light. Thus, it is possible to determine the presence and/or thickness of metal residue using the wavelength or wavelengths of the reflected light.
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