Plating apparatus and plating method

摘要

A plating apparatus has an ashing unit ( 300 ) configured to perform an ashing process on a resist ( 502 ) applied on a surface of a seed layer ( 500 ) formed on a substrate (W), and a pre-wetting section ( 26 ) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section ( 28 ) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit ( 34 ) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film ( 504 ) on the surface of the seed layer formed on the substrate.