Shield unit for TiN sputtering apparatus, method of coating the same, and sputtering method

摘要

The present invention relates to a shield unit for a titanium nitride (TiN) sputtering apparatus that can reduce or prevent generation of unwanted particles. An exemplary shield unit for the sputtering apparatus according to an embodiment of the present invention includes an upper shield having a titanium (Ti) coating on an upper portion thereof and (optionally) an aluminum (Al) coating on a lower portion thereof, and a lower shield having a titanium (Ti) on at least part of a sidewall thereof and (optionally) an aluminum (Al) on a bottom surface thereof.