发明名称 IC substrate with over voltage protection function
摘要 The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.
申请公布号 US2006138609(A1) 申请公布日期 2006.06.29
申请号 US20060363771 申请日期 2006.02.28
申请人 INPAQ TECHNOLOGY CO., LTD. 发明人 LEE CHUN-YUAN
分类号 H01L23/12;H01L23/552;H01C7/10;H01C7/12;H01L21/48;H01L23/52;H01L23/62 主分类号 H01L23/12
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