Preshaped filler for soldering printed circuit board, has cavity filled with flux material, such that flux material is provided in advance between solders for fixing component on printed circuit board through manual or automatic assembly

摘要

The preshaped filler has a cavity (2) filled with flux material (3), such that the flux material is provided in advance between the solders (7) used to fix an electronic component (6) on a printed circuit board (5) through manual or automatic assembly. The preshaped filler is expandable based on the type of component to be mounted on the printed circuit board.