| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat conductive and heat resistant polyimide composite material, usually, useful as a dielectric layer of an electronic device or a precursor metal laminate laid with a metallic layer on one surface (or the both surfaces) of the dielectric because heat removal is important consideration for all device designers and in electronic devices. <P>SOLUTION: The polyimide composite material includes 40-85 wt.% heat conductive filler particles therein. The film composite material thereof has good dielectric strength, good heat conductivity and, as the case may be, good adhesion. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
