| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor apparatus, which can correspond not only to the cost reduction of a lead frame, but also to an easily upgraded in version for the semiconductor apparatus. SOLUTION: On a lead frame 1 of the resin-sealed semiconductor apparatus, die pads 7 to 9, where power elements 2 and 3 and an IC 4 for control are mounted, a terminal lead 10 of a main circuit, control power supply, and signal circuit which are arranged in a row at one side and drawn out, and dam bar 11 connecting each lead 10, are pattern-formed. At least a main circuit terminal, corresponding to power elements 2 and 3 and IC 4 for controlling and terminal for the control power supply, are formed by drawing out a plurality of leads from each terminal in advance. After internal wiring has been conducted among the power elements 2 and 3 mounted on die pads 7 to 9, and IC 4 for control, and with their periphery being resin-sealed, necessary leads are left, and others are cut along with the dam bar 11. Further, without changing the arrangement of the terminal lead 10, its inner lead is coped flexibly to circuit changes. COPYRIGHT: (C)2006,JPO&NCIPI
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