| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a device having a 3-dimensional tapered structure, wherein controllability and reproducibility are satisfactory, and manufacturing efficiency is excellent, and the quality of material of the whole of a layer is uniform so as to obtain desired characteristics. SOLUTION: In the method for manufacturing the device having 3-dimensional tapered structure, after a core 2 is formed on a substrate 1, an etched surface 2a is formed by etching a part of the core 2 with reactive ion etching, and also grooves 3 are formed on the surface of the core 2 which is not etched. The grooves 3 are formed in parallel so that grooves having the same size and the same shape are arranged while intervals of the grooves are gradually narrowed toward a direction of the etched surface 2a. Moreover, a tapered structure having a tapered surface 5 is realized by changing the shape of the core 2 with reflow of itself of the core 2 while performing annealing at 700-1400°C. In the end, a circuit pattern is formed by photolithography and an element having 3-dimensional tapered surfaces is obtained by etching the core 2 with the reactive ion etching. COPYRIGHT: (C)2006,JPO&NCIPI |
