发明名称 |
Coating for enhancing adhesion of molding compound to semiconductor devices |
摘要 |
A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution. |
申请公布号 |
EP1675172(A1) |
申请公布日期 |
2006.06.28 |
申请号 |
EP20050077942 |
申请日期 |
2005.12.20 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
LI, JIANXIONG;CHAW, CHI CHUEN;TSUI, NGAI KIN;LIU, DEMING;KWAN, YIU FAI |
分类号 |
H01L23/31;H01L23/495;H01L23/498 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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