发明名称 INORGANIC POWDER-CONTAINING RESIN COMPOSITION AND DIELECTRIC LAYER-FORMING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an inorganic powder-containing resin composition capable of forming a dielectric layer free from residue of foam and having high light transmission, a film-forming material layer composed of the composition, a transfer sheet and an dielectric layer and to provide a method for producing a dielectric layer-forming substrate and to provide the dielectric layer-forming substrate. SOLUTION: The inorganic powder-containing resin composition comprises (A) inorganic powder, (B) a binder resin, (C) at least one kind of phosphorus-containing material selected from a group consisting of red phosphorus, an inorganic phosphorus compound, a phosphorus-based compound represented by general formula (1) (X is O, S, Se, Te or NH) and its salt and a phosphorus-based compound represented by general formula (2) and its salt. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006161006(A) 申请公布日期 2006.06.22
申请号 JP20040358715 申请日期 2004.12.10
申请人 NITTO DENKO CORP 发明人 HATANAKA TOSHIHIRO;KUME KATSUYA;BABA NORIHIDE;KAI MAKOTO;MUSASHIJIMA YASUSHI
分类号 C08L101/00;B32B27/18;B32B27/30;C03C8/24;C08K3/00;C08K3/02;C08K3/32;C08K5/49;C08L33/04;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01J11/38 主分类号 C08L101/00
代理机构 代理人
主权项
地址