| 摘要 |
A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices ( 2 ). The assembly is made by providing first and second laminates ( 7,8 ), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack ( 1 ) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface ( 3 ) of the stack, and making a plurality of electrical connections ( 31,51 ) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
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