发明名称 |
METHOD OF APPLYING PHOTOSENSITIVE CURABLE RESIN AND ADHESION METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of applying photosensitive curable resin that facilitates the control of positions where the resin is applied, and to provide an adhesion method using the method. <P>SOLUTION: The UV curable resin layer 12 side of an adhesive sheet 10 is stuck to a package substrate 4 that is provided with through-holes 20. Light 30 is irradiated to the UV curable resin layer 12 through the through-holes 20 to cure parts thereof exposed to the through-holes 20. The cured UV curable resin layer 12A is removed together with a base film 11. A glass plate 2 is stuck to a UV curable resin 15 that remains on the package substrate 4 and is adhered thereto by irradiating light 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006165180(A) |
申请公布日期 |
2006.06.22 |
申请号 |
JP20040352899 |
申请日期 |
2004.12.06 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NANO MASANORI;NISHIO TETSUSHI;FUKUDA TOSHIYUKI |
分类号 |
H01L27/14;H01L23/02;H01L23/10;H01L23/12 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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