发明名称 METHOD OF APPLYING PHOTOSENSITIVE CURABLE RESIN AND ADHESION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of applying photosensitive curable resin that facilitates the control of positions where the resin is applied, and to provide an adhesion method using the method. <P>SOLUTION: The UV curable resin layer 12 side of an adhesive sheet 10 is stuck to a package substrate 4 that is provided with through-holes 20. Light 30 is irradiated to the UV curable resin layer 12 through the through-holes 20 to cure parts thereof exposed to the through-holes 20. The cured UV curable resin layer 12A is removed together with a base film 11. A glass plate 2 is stuck to a UV curable resin 15 that remains on the package substrate 4 and is adhered thereto by irradiating light 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006165180(A) 申请公布日期 2006.06.22
申请号 JP20040352899 申请日期 2004.12.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NANO MASANORI;NISHIO TETSUSHI;FUKUDA TOSHIYUKI
分类号 H01L27/14;H01L23/02;H01L23/10;H01L23/12 主分类号 H01L27/14
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