发明名称 |
Power core devices and methods of making thereof |
摘要 |
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
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申请公布号 |
US2006133057(A1) |
申请公布日期 |
2006.06.22 |
申请号 |
US20050289961 |
申请日期 |
2005.11.30 |
申请人 |
MCGREGOR DAVID R;AMEY DANIEL I JR;BANERJI SOUNAK;BORLAND WILLIAM J;DIETZ KARL H;SREERAM ATTIGANAL N |
发明人 |
MCGREGOR DAVID R.;AMEY DANIEL I.JR.;BANERJI SOUNAK;BORLAND WILLIAM J.;DIETZ KARL H.;SREERAM ATTIGANAL N. |
分类号 |
H05K7/06 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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