Micromechanical device and method of manufacturing a micromechanical device

摘要

The device has a substrate (3) and a structured layer (5), which is provided on a part of the substrate (3) and partly covered by a cap (1). Between the cap (1) and the substrate (3) a leading connection (8) is provided, which is arranged by the structured layer (5) and which extends through to a frame structure (15) of the structured layer. The leading connection (8) is formed by a passage (9) and or a hole, on whose floor space and wall surfaces (9a) a conducting layer (10) is applied. The passage (9) and or the conducting layer (10) are removed by an isolation layer (22) and the structured layer is turned away on a side (3a) of the substrate. The cap (1), substrate and the structured layer are made of the same material such as silicon. Preferably the cap, the substrate and the structured layer are made from polycrystalline silicon of single-crystal silicon. An independent claim is included for a method of manufacturing a micromechanical device.