发明名称 |
Semiconductor device and voltage regulator |
摘要 |
A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance. |
申请公布号 |
US7061093(B2) |
申请公布日期 |
2006.06.13 |
申请号 |
US20040486885 |
申请日期 |
2004.02.17 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
KIMURA KEIICHI;TAKAI MASAMI |
分类号 |
H01L29/00;H01L23/31;H01L23/48;H01L23/52;H01L23/522;H01L23/538;H01L29/40 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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