| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of a semiconductor device which contributes to an increase of productivity by forming a bump shape which is optimum for bonding a semiconductor chip and a substrate via a bump, and a manufacturing method of a semiconductor device which can increase productivity by improving position recognition accuracy of the substrate and detection accuracy of the bump. <P>SOLUTION: The manufacturing method of a semiconductor device has a flattening mechanism part 5 which flattens a bump top by pressurizing the top d of the bump B provided to at least one of the substrate P and a semiconductor chip H, and a bonding mechanism 10 which carries out bonding between the substrate and the semiconductor chip via the bump whose top is flattened by the flattening mechanism. The flattening mechanism is constituted of a bump recognition camera 6 for imaging the bump, a flattening tool 7 provided with a pressurizing surface for pressurizing the top of the bump, and a driving mechanism 8 having a pressurizing mechanism for moving and adjusting the flattening tool to a bump position detected by the bump recognition camera and pressurizing the pressurizing surface of the flattening tool to the bump. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
