发明名称 WIRING BOARD AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve the problem of a wiring board comprising an insulating layer, a wiring conductor and a through conductor that an external connection terminal arranged on the surface of the wiring board is stripped therefrom. SOLUTION: The wiring board 5 comprises an insulating layer 1, a wiring conductor 2 arranged on the insulating layer 1, and a through conductor 3 being connected electrically with the wiring conductor 2. On the surface of the wiring board 5, an external connection terminal 4 connected electrically with the through conductor 3 is provided while being buried in the insulating layer 1. The external connection terminal 4 consists of a metal foil and the outer circumferential portion 4a thereof has a wavelike profile where the iteration length S is 2-20% of the circumference of the external connection terminal 4 and the amplitude d is 2-20% of the diameter D of the external connection terminal 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006148167(A) 申请公布日期 2006.06.08
申请号 JP20060049110 申请日期 2006.02.24
申请人 KYOCERA CORP 发明人 HAYASHI KATSURA;MATSUNAGA TAKAHIRO;SERI TAKUJI
分类号 H01L23/12;H01L21/60 主分类号 H01L23/12
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