发明名称 Structure of strained silicon on insulator and method of manufacturing the same
摘要 Provided is a strained SOI structure and a method of manufacturing the strained SOI structure. The strained SOI structure includes an insulating substrate, a SiO<SUB>2 </SUB>layer formed on the insulating substrate, and a strained silicon layer formed on the SiO<SUB>2 </SUB>layer.
申请公布号 US2006118870(A1) 申请公布日期 2006.06.08
申请号 US20050071150 申请日期 2005.03.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK YOUNG-SOO;XIANYU WENXU;NOGUCHI TAKASHI
分类号 H01L27/12 主分类号 H01L27/12
代理机构 代理人
主权项
地址