| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide form reduced in relatively high hygroscopicity inherent in polyimide while retaining the high functionality of the form, especially film, thus provided with such performances that its electrical insulation is not highly affected by humidity when used in the electrical/electronic material field, and to provide a method for producing the polyimide form. SOLUTION: The polyimide form is characterized by being formed from a resin composition comprising (A) 40-90 mass% of a polyimide resin and (B) 10-60 mass% of hydrophobic polymeric powder≤0.5 mass% in water absorption,≥300°C in thermal decomposition temperature and≤50μm in volume-average particle size D. The method for producing the polyimide form comprises the step of incorporating the hydrophobic polymeric powder in a polyamic acid solution as polyimide precursor, an initially forming step, a primarily drying step and the step of heat treatment at a temperature higher than the softening point but lower than the thermal decomposition temperature of the hydrophobic polymeric resin. COPYRIGHT: (C)2006,JPO&NCIPI |
