| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of mounting an electronic component onto a printed wiring board and a mounting method thereof that can stably locate, solder and mount the electronic component, which cannot stably be fitted because of its outer shape, onto the printed wiring board. SOLUTION: The mounting method is configured to include the steps of: adhering an insulating base chip 11 used for tentatively fixing the electronic component 21 to a prescribed position on the printed wiring board 1, the prescribed position being determined related to the mounted electronic component 21; tentatively fixing the electronic component 21 via an adhering layer 14 provided to an upper side 13 of the base chip 11; and soldering and mounting the electronic component 21 to a side of the printed wiring board 1 by passing the printed wiring board 1 through a soldering bath after the tentative fixing. COPYRIGHT: (C)2006,JPO&NCIPI
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