发明名称 PHOTOSENSITIVE COMPOSITION AND METHOD FOR FORMING PATTERN USING IT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which is used in the manufacturing step of a semiconductor such as an IC, in manufacturing step of a circuit board such as liquid crystals and thermal heads, and other photofabrication steps, having an excellent resolution and line edge roughness; and to provide a method for forming a pattern using the same. <P>SOLUTION: The photosensitive composition contains (A) a resin having a repeating unit of a specific group, whose solubility in an alkaline developer increases by the action of an acid, and the method is disclosed for forming a pattern using the same. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006146143(A) 申请公布日期 2006.06.08
申请号 JP20050180979 申请日期 2005.06.21
申请人 FUJI PHOTO FILM CO LTD 发明人 KODAMA KUNIHIKO
分类号 G03F7/039;C08F220/28;H01L21/027 主分类号 G03F7/039
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