| 摘要 |
A multi-layer chip capacitor comprises a capacitor body formed by stacking a plurality of dielectric layers; a plurality of first and second internal electrodes formed on the dielectric layers, each having at least one through hole formed through at least one side thereof; lowermost electrode patterns, each including a lead portion extended to one side of the capacitor body, and a via contact portion; a plurality of conductive vias, vertically extended to pass through the through holes so as not to contact the inner surfaces of the through holes, each of the contact vias connected to either the first or second internal electrode and contacting the via contact portion; and a plurality of terminal electrodes formed on the outer surface of the capacitor body, and connected to the conductive vias through the lead portions. The conductive vias connected to the first internal electrodes are connected to the terminal electrodes having a first polarity, and the conductive vias connected to the second internal electrodes are connected to the terminal electrodes having a second polarity.
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