| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, its manufacturing method, and flexible wring board which realizes at a lower cost and simply mounting a high reliability IC on the flexible wiring board having inner leads and a related wiring pattern on its mounting area. SOLUTION: On the mounting area 12 of a flexible wiring board 11 there are at least a plurality of inner leads 121 and a wiring pattern 122 laid thereon. Solder resist 14 covers specified parts on a wiring area 13 and the pattern 122 of the mounting area 12. A bare chip IC 15 has its bump electrodes 16 opposed to the mounting area 12, and its bump electrodes 16 are metal-bonded to the inner lead 121 corresponding to them or the wiring pattern 122. Seal resin 17 takes the form of protecting the metal-bonded part to the mounting area 12 of the IC 15. COPYRIGHT: (C)2006,JPO&NCIPI
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