SEMICONDUCTOR PACKAGE USING A BOARD WITH THROUGH HOLE,申请号KR20040098701-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SEMICONDUCTOR PACKAGE USING A BOARD WITH THROUGH HOLE
摘要
申请公布号	KR20060059574(A)	申请公布日期	2006.06.02
申请号	KR20040098701	申请日期	2004.11.29
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	YANG, SUN MO;LEE, GUN AH
分类号	H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Electron tube for communication

Switch device and method for controlling a sprayer

Substituted pyridines

Poly(arylene ethers) with pendant crosslinkable groups, and devices incorporating same

Shallow self isolated doped implanted silicon process

Manufacture of probe unit having lead probes extending beyond edge of substrate

Method for manufacturing semiconductor device and semiconductor device

Method for detecting urease

Method for determining the mechanism of HIV RT inhibitors

Polyester film having improved oxygen barrier and poly(m-xyleneadipamide)-containing overlayer, process for its production and its use

MR fluid for increasing the output of a magnetorheological fluid device

Method for selective recovery and dewatering sewage sludge by using sludge-coal-oil co-agglomeration

Sanitary filtration plant with helical filter elements

Light therapy apparatus

Couling arrangement

Optical fiber cartridge with easily installed body

Recliner assembly for vehicle seats

Motor vehicle bodywork assembly

Process to make high-k transistor dielectrics