发明名称 CONDUCTIVE GEL COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive gel composition superior in flexibility and capable of demonstrating conductivity at low load. SOLUTION: This is the conductive gel composition containing a substrate resin consisting of styrene system elastomer, a softening agent, and a conductive filler. The conductive gel composition contains the softening agent 200-1,500 parts by weight and the conductive filler 150-3,000 parts by weight against the substrate resin 100 parts by weight, and the durometer hardness is A40 or less. It is desirable that the conductive filler has aspect ratio of 1-5. Furthermore, the conductive gel composition can be used for an electrode material for microphone holder, a shield packing, a gasket, and a grounding member for electronic equipment. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140105(A) 申请公布日期 2006.06.01
申请号 JP20040330801 申请日期 2004.11.15
申请人 KITAGAWA IND CO LTD 发明人 SUKEOKA TERUAKI;KATO HIROAKI
分类号 H01B1/22;C08K3/00;C08K5/00;C08L53/02;H01B1/00;H05K9/00 主分类号 H01B1/22
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