| 摘要 |
PROBLEM TO BE SOLVED: To clean main surfaces of a substrate at both sides in which the one main surface is not fit for wet cleaning. SOLUTION: A substrate cleaning apparatus 1 includes a circular substrate holding part 2 for holding the outer edge of the substrate 9, a first cleaning mechanism 3 for dry physical cleaning the lower surface of the substrate 9, and a second cleaning mechanism 4 for wet cleaning the upper surface of the substrate 9 using liquid. The first cleaning mechanism 3 has a spray nozzle 31 of external hybrid model 2-fluid nozzle for injecting particulate of solid carbon dioxide toward the lower surface of the substrate 9. The second cleaning mechanism 4 has a cleaning liquid supply part 42 for supplying the cleaning liquid to the top surface of the substrate 9, and a cleaning brush 41 for cleaning the top surface of the substrate 9 to which the cleaning liquid is supplied. In the substrate cleaning apparatus 1, dry physical cleaning is performed by the first cleaning mechanism 3 to the lower surface of the substrate 9 held at the substrate holding part 2, the wet cleaning is performed according to the second cleaning mechanism 4 to the upper surface, and the one main surface can clean simultaneously the main surface of both sides of the substrate which is not fit for the wet cleaning. COPYRIGHT: (C)2006,JPO&NCIPI
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