| 发明名称 |
Method for manufacturing a contact spring, particularly a relay contact spring, for high current load |
| 摘要 |
<p>Method for manufacturing a contact spring in which a contact spring is prepared from stamped/pressed copper material and by heat treatment of the contact spring tempering color is generated which raises the emission degree of the contact spring.</p> |
| 申请公布号 |
EP1662525(A1) |
申请公布日期 |
2006.05.31 |
| 申请号 |
EP20050025507 |
申请日期 |
2005.11.23 |
| 申请人 |
TYCO ELECTRONICS AMP GMBH |
发明人 |
HOFFMANN, RALF;RAHN, BERND;ZIEGLER, TITUS |
| 分类号 |
H01H11/04;H01H1/02;H01H49/00;H01H50/54 |
主分类号 |
H01H11/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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