发明名称 |
APPARATUS FOR PARTIALLY REMOVING PLATING FILMS OF LEADFRAME |
摘要 |
AN APPARATUS FOR PARTIALLY REMOVING PLATING FILMS OF A LEADFRAME (1) INCLUDES A MASK MEMBER (3) HAVING ANNULAR OPENINGS (4) CONFIGURED TO COINCIDE WITH THE PREDETERMINED AREAS OF THE LEADFRAME FOR WHICH PLATING FILMS ARE NOT REQUIRED; A MASK SUPPORTING MEANS (5) HAVING OUTFLOW CHANNELS (6) TO INTRODUCE A FILMS REMOVING LIQUID, FILM REMOVING LIQUID OUTFLOW HOLES (7), FILM REMOVING LIQUID INFLOW CHANNELS (9), AND AN INSOLUBLE CATHODE WIRE HOUSING GROOVE (12); A MECHANISM FOR SUPPLYING A POWER TO CONTINUOUSLY RUN AN INSOLUBLE CATHODE WIRE (13); AND A MECHANISM FOR MASKING THE UPPER SURFACE OF THE LEADFRAME PLACED AT A PREDETERMINED POSITION OF THE MASK SUPPORTING MEMBER. IN THIS WAY, THE PLATING FILMS DEPOSITED OUTSIDE AN AREA FOR WHICH PLATING IS NECESSARY ARE EASILY REMOVED AND COST CAN BE REDUCED.(FIGURE 3) |
申请公布号 |
MY123445(A) |
申请公布日期 |
2006.05.31 |
申请号 |
MY1999PI01057 |
申请日期 |
1999.03.20 |
申请人 |
SUMITOMO METAL MINING CO., LTD, |
发明人 |
KAZUO MAETANI;TAKASHI KOBAYASHI;KEISUKE WADA |
分类号 |
C25F7/00;H01L23/50;C25F5/00 |
主分类号 |
C25F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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