Multi-chips semiconductor device assemblies and methods for fabricating the same

摘要

Multi-chip semiconductor device assemblies and methods for fabricating such assemblies are provided. An exemplary assembly comprises a first chip having a first surface and comprising a plurality of conductive pads disposed at the first surface and a plurality of circuits. Each of the pads is electrically coupled to one of the circuits. A second chip having a second surface is disposed adjacent to the first surface of the first chip. The second chip comprises a plurality of bonding members disposed at the second surface. Each of the bonding members is connected to a corresponding pad. The second chip is electrically coupled to at least one of the circuits via a corresponding pad and a corresponding bonding member. The second chip comprises a first and a second portion. The first portion overlies at least a portion of the first chip and the second portion extends beyond the first chip.