| 摘要 |
PROBLEM TO BE SOLVED: To provide a method that forms fine metal patterns without etching and enables metal patterns with a good adhesivenes of board and metal film to be formed even when the board surface scarcely contains concaves and convexes. SOLUTION: This method consists of three sequential processes: (a) process for creating a patternized polymer that has a functional group interacting with an electroless plating catalyst or its precursor, and forms a chemical union with the corresponding board directly; (b) process for absorbing or assigning the electroless plating catalyst or its precursor on the corresponding pattern; and (c) process for conducting electroless coating and forming patternized metal films. In the board to be used here, each of concaves and convexes on the board surface is desirable to be 500 nm or shorter in depth. COPYRIGHT: (C)2006,JPO&NCIPI
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