| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method of a semiconductor chip for preventing short-circuiting caused by the contact of adjacent wires and hence reducing the pitch between terminals when forming wiring for connecting the connection terminal of the semiconductor chip to the substrate-side terminal of a substrate by using a droplet discharge method, and packaging the semiconductor chip onto the substrate. <P>SOLUTION: In the packaging method of the semiconductor chip, the semiconductor chip 2 in which the connection terminal 3 is arranged is packaged onto the substrate 1 on which the substrate-side terminal 4 is arranged, and the connection wiring is formed by the droplet discharge method. The semiconductor chip 2 is packaged onto the substrate 1, and first connection wiring 7, which connects one or a plurality of connection terminals 3 to the corresponding substrate-side terminal 4, is formed. The first wiring 7 is covered for forming a first insulating layer 8, and second connection wiring 9, which connects one of connection terminals 3 in which no first connection wiring 7 is formed or the plurality of connection terminals 3 to the substrate-side terminal 4 corresponding to the connection terminals, is formed. The second connection wiring 9 is formed for forming a second insulating layer 10, and the entire connection wiring is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
