Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material (120). This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.
申请公布号
EP1181716(A4)
申请公布日期
2006.05.24
申请号
EP20000928252
申请日期
2000.04.20
申请人
CALIFORNIA INSTITUTE OF TECHNOLOGY
发明人
BARMATZ, MARTIN B.;MAI, JOHN D.;PIKE, WILLIAM T.;BUDRA, NASSER K.;JACKSON, HENRY W.
