| 发明名称 |
Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method |
| 摘要 |
Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a viscosity ratio thereof is not more than 2.
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| 申请公布号 |
US7049223(B2) |
申请公布日期 |
2006.05.23 |
| 申请号 |
US20030646703 |
申请日期 |
2003.08.25 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SASAKI KEIICHI;KIMURA MANABU;HISATSUNE YOSHIMI;HAYASAKA NOBUO |
| 分类号 |
H01L21/4763;H01L21/288;H01L21/44;H01L21/768;H01L23/48 |
主分类号 |
H01L21/4763 |
| 代理机构 |
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